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Kunshan Ador Electronics Co ., Ltd

铆压高度的测量/Crimp Height Testing

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Crimp Height Testing

1. Complete tool set-up procedure.

2. Crimp a minimum of five samples.

3. Place the flat blade of the crimp micrometer across the center of the dual radii of the conductor

crimp. Do not take the measurement near the conductor bell mouth.

4. Rotate the micrometer dial until the point contacts the bottom radial surface. If using a caliper, be certain not to measure the extrusion points of the crimp.

5. Record crimp height readings. A minimum of five crimp height readings is necessary to confirm each set-up. Aminimum of 25 readings is necessary to determine capability.

6. Check crimp height every 250 to 500 parts throughout the run.

压接高度测量

1. 按步骤完成工具设置。

2. 压接至少5个样品。

3. 把压接测微仪扁平叶片卡到芯线压接框的双半径中心。不要在芯线压接框喇叭口附近测量。

4. 旋转测微仪拨盘,直到测量头接触到底部径向(弯曲)表面。若使用卡尺,则要确保不要测量压接挤出处。

5. 记录压接高度读数。至少要获取五个压接高度读数来确认每次设置。至少要获取二十五个读数才能确定制程能力。

6. 在压接操作期间,每压接250到500个端子后就要检查一次压接高度。